Overview

Main Processor Module Components:

• 3101 MP Module: Supports up to 14 I/O modules.
• 2101 MP Baseplate: Houses three MP Modules.

A minimum Trident system consists of one MP Baseplate housing three MP Modules. Each MP Module serves as one channel of the Trident system. An MP Module is comprised of processors that execute the following firmware:

• Application Processor
• System Executive (SX)
• I/O Processor
• Input/Output Executive (IOX)

Specifications

• SX Processor:

  • Type: Motorola MPC860
  • Architecture: 32-bit
  • Clock Speed: 50 MHz

• Flash PROM:

  • Size: 6 MB (used for SX, IOX, and control application storage)
  • Feature: CRC-protected

• DRAM:

  • Size: 16 MB (used for SX control application execution and program/SOE data)
  • Feature: Byte parity

• NVRAM:

  • Size: 8 KB (used for retentive variables)
  • Feature: CRC-protected

• Clock Calendar:

  • Accuracy During Power On:
    • 1 sec/day typical
    • 2.2 sec/day maximum
  • Accuracy During Power Off (with battery backup):
    • 2.2 sec/day typical
    • 9.2 sec/day maximum

• Battery:

  • Type: ½ AA lithium
  • Predicted Life: 15 years

• TriBus:

  • Speed: 25 Mbps
  • Feature: CRC-protected
  • Architecture: 32-bit + parity DMA

• TriStation Port:

  • Type: 10BaseT Ethernet connector
  • Connector: RJ-45 shielded connector on baseplate

• Modbus Port:

  • Type: RS-232/485 DTE
  • Connector: DB-9-pin shielded connector on baseplate

• Debug Port:

  • Used to access diagnostic information
  • Connector: RJ-12 (located on baseplate, shared with IOX debug port)

• Communication Bus:

  • Type: RS-485
  • Speed: 2 Mbps HDLC

• Alarm Contacts:

  • Configuration: Redundant, normally closed