{"product_id":"ge-ic200chs006-versamax-local-communications-carrier-module","title":"GE IC200CHS006 VersaMax Local Communications Carrier Module","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe 100% Brand New GE IC200CHS006 provides the mechanical mounting base and electrical interface for VersaMax communication modules (e.g., IC200BEMxxx series) and high-density 32-point discrete I\/O modules. It features screw-type terminals for field wiring and snaps onto standard 35mm DIN rails. The carrier establishes the backplane connection for data exchange between the mounted module and the VersaMax CPU.\u003c\/p\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cul class=\"ybc-ul-component list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCarrier Type:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eLocal Communications \/ High-Density I\/O\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eTerminal Type:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eScrew-type (High-density)\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eWiring Capacity:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e0.5 mm² to 2.5 mm² (20 to 12 AWG)\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eModule Capacity:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e1 VersaMax Module\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eMounting:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e35mm DIN Rail (EN 50022)\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCurrent Rating:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e8 A per Power\/Ground, 2 A per I\/O point\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eVoltage Transients:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e300 VAC Max\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eBackplane Connection:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eIntegrated male\/female bus connectors\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eOperating Temp:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e0°C to +60°C\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDimensions:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e120 x 100 x 30 mm (Approx.)\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eWeight:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e0.21 kg (0.46 lbs)\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eEngineering Advantages\u003c\/h3\u003e\n\u003cul class=\"ybc-ul-component list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eAccommodates Complex Wiring:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe screw-terminal design handles the higher wire counts required by communication modules (multiple bus lines, shields) and 32-point discrete modules, eliminating the need for external splice blocks.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eSecures Sensitive Electronics:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe carrier provides a stable, grounded platform. It protects communication modules from vibrational stress and ensures shielded cables terminate correctly to minimize EMI on high-speed buses (Profibus\/DeviceNet).\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eSimplifies Panel Expansion:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eTechnicians snap the carrier onto DIN rails anywhere in the panel, not just in pre-drilled rack positions. This allows distributed I\/O clusters near field devices, reducing long home-run cables.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eEnsures Bus Integrity:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe integrated backplane connectors pass logic power and bus signals seamlessly. The rigid mounting maintains pin contact integrity for deterministic data transfer required by fieldbus protocols.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFAQs\u003c\/h3\u003e\n\u003cul class=\"ybc-ul-component list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eWhich modules are compatible with this carrier?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe IC200CHS006 primarily supports VersaMax Communication Modules (IC200BEM002, IC200BEM103, IC200BEM104, etc.) and high-density 32-point discrete I\/O modules. It generally does not support analog modules or isolated high-voltage modules.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDoes this carrier use a 36-pin connector like the IC200CHS003?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eNo. The IC200CHS006 uses screw terminals for field wiring. The IC200CHS003 uses a 36-pin D-sub connector requiring a cable. Choose the CHS006 when direct point-to-point wiring is preferred over pre-wired cables.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCan I mix this carrier with Box\/Spring carriers in one system?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eYes. The VersaMax system supports mixing different carrier types (CHS001, CHS002, CHS003, CHS006) on the same DIN rail or rack, as long as the specific I\/O module's isolation requirements match the carrier type.\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDoes the carrier require a separate power supply?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eNo. The carrier draws backplane power (5V\/3.3V) for logic. Field devices (like sensors or comms terminations) may require an external 24VDC supply wired to the carrier terminals depending on the module type.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52373384200504,"sku":"IC200CHS006","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/IC200CHS0062.jpg?v=1778812151","url":"https:\/\/www.automodulexpert.com\/fr\/products\/ge-ic200chs006-versamax-local-communications-carrier-module","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}