Overview

Specifications

Backplane (IMB) Supply

• Voltage: 20V DC to 32V DC

• Power: 26 W

Field Supply

• Voltage: 18V DC to 58V DC

• Maximum Current: 30 A

• Power Dissipation:

  • Field Supply at maximum power group current: 36 W

  • System Supply: 26 W

Module Location

• Slot: T8100, T8300 I/O Module Slot

Isolation

• Power Group to Power Group: 50V Reinforced (continuous)

  • [Type tested at 1411V DC for 60 s]

• Field Common:

  • 50V Reinforced (continuous)

  • 250V Basic (fault)

  • [Type tested at 2436V DC for 60 s]

• Channel to Channel: None

Fusing: Not user serviceable
Number of Outputs: 40
Number of Power Groups: Each Power Group comprises 8 channels
Output

• Output On-State Resistance: 1.6 Ω

• Maximum Current Rating (Continuous): 0.75 A per channel

• Minimum On-State Load Current: 25 mA

• Current Measurement Range: 0 A to 1.35 A ±5% / ±5 mA

• Voltage Measurement Range: 0V DC to +58V DC ±2V DC

• Maximum Withstanding Voltage: -1V DC to +60V DC

• Channel to Channel Crosstalk: < 1%

• Maximum Load Capacitance: 500 μF

• Output Short Circuit Protection: Electronic latching

Sequence of Events

• Event Resolution (LSB): 1 ms

• Time Stamp Accuracy: ±10 ms

Operating Conditions

• Operating Temperature: 0 °C to +60 °C (+32 °F to +140 °F)

• Storage Temperature: -25 °C to +70 °C (-13 °F to +158 °F)

• Relative Humidity (Operating and Storage): 10% – 95%, non-condensing

Dimensions

• Height: 266 mm (10.5 in)

• Width: 31 mm (1.2 in)

• Depth: 303 mm (12.0 in)

• Weight: 1.3 kg (2.7 lb)