{"product_id":"51404127-150-honeywell-hpm-i-o-backplane-board","title":"51404127-150 Honeywell HPM I\/O Backplane Board","description":"\u003ch2\u003eHoneywell 51404127-150 HPM I\/O Backplane Board\u003c\/h2\u003e\n\u003cp\u003eConfigured for high-density I\/O routing and power distribution in Honeywell High-Performance Process Manager (HPM) systems, the \u003cstrong\u003eHoneywell 51404127-150\u003c\/strong\u003e (\u003cstrong\u003e51404127-150\u003c\/strong\u003e I\/O Backplane Board) provides direct physical\/electrical execution for up to 15 process control modules across TDC 3000 and Experion PKS platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e51404127-150\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eHoneywell\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.75 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard 15-slot MC-HPFX02 card file assembly dimensions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eDependent on backplane bus load and installed I\/O cards\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAssembly Model\u003c\/td\u003e\n\u003ctd\u003eMC-HPFX02\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Capacity\u003c\/td\u003e\n\u003ctd\u003e15 I\/O module slots\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRedundancy Support\u003c\/td\u003e\n\u003ctd\u003eRedundant PMM (Process Manager Module) bus architecture\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProtective Coating\u003c\/td\u003e\n\u003ctd\u003eConformal coating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eChannel-to-Channel Isolation and Loop Protocol Routing\u003c\/h3\u003e\n\u003cp\u003eHoneywell DCS networks depend on backplane isolation to maintain signal fidelity across high-density field wiring networks. The \u003cstrong\u003eHoneywell 51404127-150\u003c\/strong\u003e backplane features dedicated ground routing, protective conformal coating against harsh atmospheric contaminants, and channel-to-channel isolation parameters engineered to eliminate cross-talk on 4-20 mA HART loop protocol lines. This layout prevents ground loop currents from destabilizing analog input readings while insulating sensitive digital processing logic from field-induced electrical transients.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the conformal coating on this backplane board protect against environmental exposure?\u003c\/p\u003e\n\u003cp\u003eA: The factory conformal coating forms a protective barrier over all printed circuit traces, solder joints, and surface-mount components, preventing short circuits caused by ambient moisture condensation, conductive dust, and airborne corrosive gases.\u003c\/p\u003e\n\u003cp\u003eQ: What seating and alignment steps must engineers follow when populating the 15 slot locations?\u003c\/p\u003e\n\u003cp\u003eA: Align each I\/O card precisely along the chassis guide rails before engaging the rear multi-pin backplane connectors. Push the module firmly until the connector latching mechanisms engage fully, then tighten the top and bottom retaining screws to ensure uniform pin contact and prevent backplane bus separation under industrial vibration.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eMount the 15-slot card file assembly securely into the cabinet frame using standard mounting hardware. Establish a low-resistance earth connection by running a dedicated ground strap directly from the chassis earth ground point to the main cabinet ground bus bar before applying power.\u003c\/p\u003e\n\u003cp\u003eRoute 24 VDC power conductors and signal wiring through separate wiring ducts to avoid electromagnetic noise coupling. Maintain continuous cable shield drain wire connections to designated shield ground terminals at the cabinet base. When performing system maintenance or module hot-swapping, confirm that power feeds are switched off or verify that local environmental conditions meet non-incendive safety standards prior to inserting or extracting backplane cards.\u003c\/p\u003e","brand":"HONEYWELL","offers":[{"title":"Default Title","offer_id":51284165394744,"sku":"51404127-150","price":250.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/587._b3c92c56-0f54-42df-b2b4-8ed73fbc89b5.jpg?v=1791525704","url":"https:\/\/www.automodulexpert.com\/products\/51404127-150-honeywell-hpm-i-o-backplane-board","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}