Allen-Bradley 1769-IQ6XOW4 CompactLogix Digital Combination Module
Configured for discrete signal acquisition and relay control execution in CompactLogix systems, the Allen-Bradley 1769-IQ6XOW4 (1769-IQ6XOW4 Digital Combination Module) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769-IQ6XOW4 |
| Brand | Allen-Bradley |
| Origin | Malaysia |
| Weight | 0.75 lbs (0.34 kg) |
| Dimensions | 118 x 35 x 87 mm (H x W x D) |
| Operating Temp | 0 deg C to 60 deg C |
| Power Consumption | Current draw: 105 mA @ 5.1 VDC, 50 mA @ 24 VDC (Heat Dissipation: 2.75 W) |
| Input Capacity | 6 channels, 24 VDC sink/source |
| Input Voltage Range | 10 VDC to 30 VDC @ 30 deg C; 10 VDC to 26.4 VDC @ 60 deg C |
| Output Capacity | 4 channels, AC/DC normally open relay contacts |
| Output Voltage Range | 5 VAC to 265 VAC, 5 VDC to 125 VDC |
| Max Output Current | 2.5 A per point, 8 A per module |
| Isolation Voltage | 1200 VAC for 1 s or 1697 VDC for 1 s |
| Wire Size | 22 to 14 AWG solid copper (rated 90 deg C) |
| Replacement Terminal Block | 1769-RTBN18 |
Backplane Bus Communication Velocity & I/O Density Scaling
The 1769-IQ6XOW4 integrates directly into the local 1769 Compact I/O bus using an integrated movable bus connector and tongue-and-groove locking mechanism. Furthermore, backplane bus communication velocity allows real-time status updates of both the 6 DC input channels and the 4 relay output channels within single controller scan cycles. Optimizing I/O density scaling via combination modules reduces overall rack footprint, while deterministic networks like EtherNet/IP process the discrete data across distributed CompactLogix architectures without added signal transmission latency.
Frequently Asked Questions
Q: What is the maximum power supply distance rating for the 1769-IQ6XOW4 module?
A: The 1769-IQ6XOW4 has a maximum power supply distance rating of 8 modules. You must install the module within 8 slots of a compatible 1769 system power supply (such as the 1769-PA2, 1769-PB2, 1769-PA4, or 1769-PB4) to prevent backplane bus voltage drops.
Q: Does the 1769-IQ6XOW4 module support Removal and Insertion Under Power (RIUP)?
A: No. The 1769 Compact I/O architecture does not support RIUP. Always disconnect system power from the backplane and field power sources prior to removing or installing the module to avoid hardware damage or unexpected circuit state changes.
Field Installation Guidelines
Mount the 1769-IQ6XOW4 onto a standard 35 mm DIN rail or secure it to an enclosure backplate using panel mounting screws. Ground the system enclosure properly by bonding the DIN rail to the protective earth (PE) bus using heavy-gauge copper wiring. Maintain adequate space above and below the module for natural ventilation to prevent heat buildup inside the cabinet.
Route discrete DC input wiring separately from relay output wiring carrying high AC voltages to prevent electromagnetic cross-talk. When wiring field devices to the removable 1769-RTBN18 terminal block, use 22 to 14 AWG solid or stranded copper wire rated for 90 deg C. Tighten terminal screws to a torque of 0.68 N m (6 lb in).
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| Warranty | 12 Months |
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