{"product_id":"auxiliary-i-o-terminal-board-ge-ds200ddtbg2a","title":"Auxiliary I\/O Terminal Board GE DS200DDTBG2A","description":"\u003cp\u003eThe \u003cstrong\u003eGE DS200DDTBG2A\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDS200DDTBG2A\u003c\/strong\u003e LCI Auxiliary I\/O Terminal Board, operates as a dedicated hardware component for signal conditioning and isolation within the LS2100 Static Starter Control System. The board executes high-density data transition between the ADMA analog-to-digital module and external peripheral instrumentation.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200DDTBG2A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.5 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard LS2100 footprint\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-20 deg C to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e28 VDC (Nominal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eI\/O Capacity\u003c\/td\u003e\n\u003ctd\u003e12 Channels (Mixed Analog\/Digital)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRelay Output\u003c\/td\u003e\n\u003ctd\u003e2 Form-C (20 A at 240 VAC \/ 10 A at 30 VDC)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eConnectors\u003c\/td\u003e\n\u003ctd\u003e60-pin high-density ribbon header \/ 36-position double-row\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus and Firmware Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE DS200DDTBG2A\u003c\/strong\u003e utilizes high-density ribbon connectors to maintain communication throughput across the LS2100 backplane architecture. To ensure deterministic network performance, the firmware compatibility must be verified against the host ADMA module revision. The board facilitates internal signal path synchronization, requiring specific backplane bus communication velocity settings to prevent latency in static starter activation sequences. Firmware flash procedures must be executed via the designated control rack interface to avoid I\/O mapping inconsistencies or signal processing timeouts.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Are the Form-C relay outputs on the DS200DDTBG2A hot-swappable during system operation?\u003c\/p\u003e\n\u003cp\u003eA: No. Due to the potential for electrical arcing and signal disruption to the LS2100 control loops, the system must be de-energized before removing or replacing the board.\u003c\/p\u003e\n\u003cp\u003eQ: How should the high-density ribbon cables be secured to prevent signal attenuation?\u003c\/p\u003e\n\u003cp\u003eA: Ribbon headers must be fully seated with locking clips engaged. Ensure the cable path is routed away from high-voltage AC lines to minimize electromagnetic interference on the analog signal channels.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003ePower Disconnection: Verify that the 28 VDC power source is isolated and locked out prior to handling the board to prevent accidental component damage.\u003c\/li\u003e\n\u003cli\u003eMounting: Secure the board onto the designated panel or rack standoffs using the provided mounting holes. Ensure consistent contact with the chassis ground plane to minimize noise.\u003c\/li\u003e\n\u003cli\u003eCabling: Connect the 60-pin ribbon cable to header TBPL first, ensuring proper pin orientation. Connect external I\/O wires to terminal strips TB1 through TB5, adhering to the torque specifications for standard terminal screws.\u003c\/li\u003e\n\u003cli\u003eShielding: All shielded cables should have their drain wires terminated to the system earth ground at a single common point to eliminate ground loops.\u003c\/li\u003e\n\u003cli\u003eVerification: Inspect all LED status indicators upon re-energizing the system to confirm correct relay state and power delivery.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52599983178040,"sku":"DS200DDTBG2A","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/DS200DDTBG2A.jpg?v=1783066769","url":"https:\/\/www.automodulexpert.com\/products\/auxiliary-i-o-terminal-board-ge-ds200ddtbg2a","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}