{"product_id":"digital-i-o-board-ge-ds200tcdah1b","title":"Digital I\/O Board GE DS200TCDAH1B","description":"\u003cp\u003eThe \u003cstrong\u003eGE DS200TCDAH1B\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDS200TCDAH1B\u003c\/strong\u003e Digital I\/O Board, operates as a dedicated hardware component for high-density discrete signal processing within Mark V control system platforms.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDS200\u003c\/strong\u003e: Identifies the Mark V series hardware.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTCDA\u003c\/strong\u003e: Designates the Digital I\/O board architecture.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eH1\u003c\/strong\u003e: Represents the hardware group\/generation tier.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eB\u003c\/strong\u003e: Indicates the specific revision level of the board assembly.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200TCDAH1B\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.25 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e100 x 80 x 20 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-40 to +70 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e24 VDC (plus\/minus 10 percent)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInput Load\u003c\/td\u003e\n\u003ctd\u003e30 mA per channel\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP deterministic networks\u003c\/h3\u003e\n\u003cp\u003eThe DS200TCDAH1B manages the acquisition and distribution of discrete digital signals between field-level devices and the Mark V backplane. It facilitates reliable state monitoring and command execution by ensuring deterministic timing for I\/O signal transitions. The board circuitry is engineered to handle industrial signal levels, providing input impedance and current sinking characteristics required for standard switch-contact and proximity-sensor integration. It maintains communication throughput across the backplane bus to ensure that digital I\/O status updates remain synchronous with the master processor cycle.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Is the DS200TCDAH1B board designed for hot-swap operations?\u003c\/p\u003e\n\u003cp\u003eA: No. Power must be removed from the rack assembly prior to removing or installing this board. Hot-swapping risks voltage transients on the backplane, which can damage the digital I\/O interface circuits.\u003c\/p\u003e\n\u003cp\u003eQ: How is signal reference handled during high-frequency switching applications?\u003c\/p\u003e\n\u003cp\u003eA: The board relies on a common ground reference. Ensure that the 24 VDC return path is solid and free of high-current interference to maintain accurate logic-level transition detection.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eEnsure the I\/O rack power supply is completely isolated and tagged out before beginning installation.\u003c\/li\u003e\n\u003cli\u003eCarefully align the board with the corresponding chassis guides to prevent damage to the backplane pins during engagement.\u003c\/li\u003e\n\u003cli\u003eApply firm, even pressure to seat the board until the backplane connectors are fully engaged.\u003c\/li\u003e\n\u003cli\u003eSecure the board using the front-panel mounting screws to ensure proper chassis grounding.\u003c\/li\u003e\n\u003cli\u003eVerify field wiring terminations at the terminal block, ensuring that input channels are correctly identified and polarities match the site-specific wiring diagrams.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52583847395640,"sku":"DS200TCDAH1B","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/DS200TCDAH1B1.jpg?v=1782804859","url":"https:\/\/www.automodulexpert.com\/products\/digital-i-o-board-ge-ds200tcdah1b","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}