{"product_id":"f-3300-hima-h41q-h51q-cpu-processors-module","title":"F 3300 HIMA H41q H51q CPU Processors Module","description":"\u003ch2\u003eHIMA F 3300 H41q\/H51q CPU Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eHIMA F 3300\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eF3300\u003c\/strong\u003e Central Processing Unit (CPU) Module, operates as a dedicated hardware component for safety application logic execution within H41q and H51q platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eF 3300\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eHIMA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eGermany\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003eStandard subrack module weight\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard HIMA subrack slot size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eStandard backplane power draw\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcessor Architecture\u003c\/td\u003e\n\u003ctd\u003eTwo clock-synchronized microprocessors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSafety Integrity Level\u003c\/td\u003e\n\u003ctd\u003eSIL3 certified according to IEC 61508\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFunction\u003c\/td\u003e\n\u003ctd\u003eSafety application execution and integrated system bus processing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eTriple Modular Redundancy (TMR) and Fail-Safe State Execution\u003c\/h3\u003e\n\u003cp\u003eThe F 3300 incorporates a duplexed architecture containing two clock-synchronized microprocessors working alongside an independent safety-related hardware watchdog. Integrated galvanic isolation barriers decouple central processor logic from field disturbance paths to preserve processing accuracy. During real-time control, both microprocessors evaluate logic independently; if an internal discrepancy or hardware fault occurs, the supervisory logic enforces a deterministic fail-safe state execution, dropping connected outputs to a de-energized safe condition while maintaining system integrity across the H41q\/H51q backplane bus.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How do the dual microprocessors handle internal hardware mismatches during operation?\u003c\/p\u003e\n\u003cp\u003eA: Integrated cross-comparison hardware continuously monitors instructions across both clock-synchronized microprocessors. Detecting a logic discrepancy immediately trips the internal safety watchdog to initiate a controlled fail-safe shutdown.\u003c\/p\u003e\n\u003cp\u003eQ: Can engineers replace the F 3300 module while the surrounding system rack remains powered?\u003c\/p\u003e\n\u003cp\u003eA: Hot-swapping the main CPU module requires verified redundant processor configurations. Ensure secondary central control modules hold active bus mastership before extracting the unit to avoid complete rack de-energization.\u003c\/p\u003e\n\u003cp\u003eQ: How does the integrated system bus interface mitigate external noise on safety loops?\u003c\/p\u003e\n\u003cp\u003eA: The onboard bus controller uses high-density optocoupler isolation stages to block high-voltage transient spikes and ground loops originating from external communications interfaces.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eEnsure complete electrostatic discharge grounding by wearing an earthed wrist strap prior to touching card edge contacts. Slide the F 3300 module along the subrack card guides until the rear multi-pin connector seats firmly into the backplane receptacle. You must tighten both upper and lower panel thumbscrews to secure the assembly against vibration and establish a low-impedance chassis frame ground connection.\u003c\/p\u003e\n\u003cp\u003eRoute all communication bus cabling through separate cable ducts away from high-voltage AC lines or inductive drive wiring. Ground cable shields at a single chassis earth point near the cabinet entry gland to minimize noise coupling and prevent ground loop currents from destabilizing central processing routines.\u003c\/p\u003e","brand":"HIMA","offers":[{"title":"Default Title","offer_id":51179317297464,"sku":"F 3300","price":188.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/F33001.jpg?v=1759132702","url":"https:\/\/www.automodulexpert.com\/products\/f-3300-hima-h41q-h51q-cpu-processors-module","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}