{"product_id":"ge-259b2460btg2-512azspbpac-100-backplane-assembly-board","title":"GE 259B2460BTG2 512AZSPBPAC-100 Backplane Assembly Board","description":"\u003cp\u003eThe \u003cstrong\u003eGE 259B2460BTG2 512AZSPBPAC-100\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003e259B2460BTG2\u003c\/strong\u003e Backplane Assembly Board, operates as a dedicated hardware component for high-speed signal distribution and module communication within Mark VI Turbine Control System platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e259B2460BTG2 512AZSPBPAC-100\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eStandard OEM\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e4 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e54 cm x 40 cm x 39 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-25 deg C to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eBackplane dependent\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBoard Type\u003c\/td\u003e\n\u003ctd\u003eBackplane Assembly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe backplane assembly facilitates the deterministic exchange of data between the controller and I\/O modules. It manages the high-speed backplane bus communication, ensuring that time-critical process data is transmitted without latency variation. This board supports the high-density I\/O scaling required for turbine control logic, providing stable electrical paths for deterministic network communication and ensuring that module firmware flash compatibility is maintained across all connected processor nodes.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions (FAQ)\u003c\/h3\u003e\n\u003cp\u003eQ: What precautions should be taken to prevent damage to the backplane pins during module installation?\u003c\/p\u003e\n\u003cp\u003eA: Ensure that each module is aligned precisely with the guide rails before insertion. Do not force modules into the slots, as bent pins can cause short circuits or intermittent communication faults across the backplane bus.\u003c\/p\u003e\n\u003cp\u003eQ: How does the backplane assembly manage signal integrity for sensitive turbine control signals?\u003c\/p\u003e\n\u003cp\u003eA: The board utilizes multi-layer PCB design with dedicated ground and power planes to minimize crosstalk and electromagnetic noise. Ensure that the chassis is properly bonded to the control system earth ground to maintain the intended signal-to-noise ratio.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003ePower down the entire Mark VI control cabinet before installing or removing the backplane assembly or any attached modules to prevent electrical transients.\u003c\/li\u003e\n\u003cli\u003eInspect the backplane connectors for debris or oxidation before seating the assembly into the rack.\u003c\/li\u003e\n\u003cli\u003eSecure the assembly using the provided mounting hardware to ensure full contact with the cabinet frame, which provides the necessary mechanical stability and grounding path.\u003c\/li\u003e\n\u003cli\u003eKeep all signal cables and I\/O wiring dressed neatly to ensure adequate airflow, preventing heat buildup within the rack assembly.\u003c\/li\u003e\n\u003cli\u003eVerify that all system power supply modules are securely seated and functioning before initializing the control system software.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52649595011384,"sku":"259B2460BTG2 512AZSPBPAC-100","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/259B2460BTG2_512AZSPBPAC-100.jpg?v=1784189484","url":"https:\/\/www.automodulexpert.com\/products\/ge-259b2460btg2-512azspbpac-100-backplane-assembly-board","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}