{"product_id":"honeywell-51401551-300-k2lcn-3-tdc-3000-processor-board","title":"Honeywell 51401551-300 K2LCN-3 TDC 3000 Processor Board","description":"\u003ch2\u003eHoneywell 51401551-300 K2LCN-3 Processor Board\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eHoneywell 51401551-300\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eK2LCN-3\u003c\/strong\u003e Processor Board, operates as a dedicated hardware component for high-speed data processing and system node communication within Honeywell TDC 3000 Local Control Network platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e51401551-300\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eHoneywell\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003eStandard Rack Weight\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Form Factor\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eDual DC\/DC Input (6.3 VDC Output)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eModule Type\u003c\/td\u003e\n\u003ctd\u003eHigh-Density Processor Board\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eArchitecture\u003c\/td\u003e\n\u003ctd\u003eTDC 3000 K2LCN-3 Node Processor\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCertifications\u003c\/td\u003e\n\u003ctd\u003eCE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003e4-20 mA HART Loop Protocol and Channel-to-Channel Isolation\u003c\/h3\u003e\n\u003cp\u003eThe 51401551-300 circuit board manages high-density processing streams across the Local Control Network bus structure, serving as the central logic engine for connected node cards. Built-in channel-to-channel isolation prevents electrical surges and common-mode line noise from propagating across the backplane bus. The processing logic filters digital signal channels and coordinates analog field inputs, stabilizing 4-20 mA HART loop protocol telemetry and maintaining scan rates during high-traffic bus arbitration cycles.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What power input arrangement does the 51401551-300 board utilize?\u003c\/p\u003e\n\u003cp\u003eA: The board incorporates dual DC\/DC power inputs that convert incoming backplane power into a regulated 6.3 VDC supply to maintain processor core operations under redundant power supply configurations.\u003c\/p\u003e\n\u003cp\u003eQ: Can the 51401551-300 board be replaced while the TDC 3000 rack remains powered?\u003c\/p\u003e\n\u003cp\u003eA: Technicians must verify system redundancy and follow node bypass procedures prior to board removal to prevent Local Control Network bus disruption or ESD damage to edge connections.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eAlign the circuit board edges with the enclosure card guides and press firmly to seat the rear multi-pin bus connectors into the backplane. Secure all front retention fasteners to maintain grounded chassis contact and mechanical retention against vibration.\u003c\/p\u003e\n\u003cp\u003eEnsure cabinet cooling fans function properly to deliver continuous airflow over the high-density processing components, maintaining ambient enclosure temperatures within 0 to 60 deg C. Ground all cable shields directly to the main copper busbar using short, low-impedance grounding straps. Separate signal lines from high-voltage AC power wiring by a minimum distance of 300 mm to avoid electromagnetic cross-talk.\u003c\/p\u003e","brand":"HONEYWELL","offers":[{"title":"Default Title","offer_id":51260729917752,"sku":"51401551-300","price":250.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/287.jpg?v=1788428075","url":"https:\/\/www.automodulexpert.com\/products\/honeywell-51401551-300-k2lcn-3-tdc-3000-processor-board","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}