{"product_id":"ic200chs001a-ge-fanuc-carrier-module-datasheet-technical-manual","title":"IC200CHS001A GE Fanuc Carrier Module | Datasheet \u0026 Technical Manual","description":"\u003cp\u003eConfigured for module housing in VersaMax control networks, the \u003cstrong\u003eGE Fanuc IC200CHS001A\u003c\/strong\u003e (\u003cstrong\u003eIC200CHS001A\u003c\/strong\u003e Carrier Module) provides direct physical\/electrical execution. This component serves as the structural foundation for the VersaMax I\/O platform, facilitating backplane signal routing and field power distribution to a maximum of three I\/O modules.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cp\u003eThe IC200CHS001A represents the standard 3-position terminal carrier assembly. The \"A\" suffix denotes the initial hardware revision, providing the mechanical interface and backplane interconnect architecture required for standard VersaMax I\/O modules.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200CHS001A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eRefer to device label\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.32 kg (0.7 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e114 x 102 x 71 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e5 VDC and 24 VDC distribution\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eI\/O Capacity\u003c\/td\u003e\n\u003ctd\u003e3 positions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe IC200CHS001A facilitates deterministic backplane bus communication by providing the physical interconnects between the I\/O modules and the CPU or network interface unit. The carrier supports the high-speed data transfer required for I\/O density scaling within the rack. Compatibility with deterministic networks is maintained through the robust alignment of the backplane bus connectors, which prevents signal impedance mismatches during high-velocity data transmission across the internal bus.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Can the terminal blocks be removed while the system is powered?\u003c\/p\u003e\n\u003cp\u003eA: While the terminal blocks are removable, it is recommended to disconnect field power before removal to prevent potential short circuits or unintended energization of field devices during re-insertion.\u003c\/p\u003e\n\u003cp\u003eQ: How is the backplane power connected to this carrier?\u003c\/p\u003e\n\u003cp\u003eA: Power is distributed to the modules via the integrated backplane, which receives 5 VDC and 24 VDC inputs directly from the designated power supply terminals located on the carrier assembly.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eMount the carrier on a 35 mm DIN rail or directly to a panel using appropriate hardware; ensure the unit is level to prevent stress on the backplane connectors.\u003c\/li\u003e\n\u003cli\u003eWhen wiring the terminal blocks, use wire sizes between 22 and 14 AWG to ensure proper fit and contact integrity within the pressure-plate terminals.\u003c\/li\u003e\n\u003cli\u003eTighten all terminal screws to a torque of 0.5 Nm (4.4 lb-in) to maintain secure electrical connections and prevent thermal degradation due to high resistance.\u003c\/li\u003e\n\u003cli\u003eEnsure that the carrier interlock mechanism is fully engaged with adjacent carriers to provide structural stability and backplane alignment across the rack assembly.\u003c\/li\u003e\n\u003cli\u003eKeep communication cables separated from high-current power distribution wires to minimize electromagnetic coupling into the backplane bus signals.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52443220083000,"sku":"IC200CHS001A","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/IC200CHS001A.jpg?v=1780299293","url":"https:\/\/www.automodulexpert.com\/products\/ic200chs001a-ge-fanuc-carrier-module-datasheet-technical-manual","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}