{"product_id":"ic200chs005-ge-fanuc-i-o-carrier-datasheet-technical-manual","title":"IC200CHS005 GE Fanuc I\/O Carrier Datasheet \u0026 Technical Manual","description":"\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC200CHS005\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC200CHS005\u003c\/strong\u003e Spring-style I\/O Carrier, operates as a dedicated hardware component for signal interconnection and module seating within Versamax system networks. This carrier provides direct physical\/electrical execution, establishing the necessary backplane interface to facilitate connection between field wiring and modular I\/O components.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200CHS005\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eVerify via product label\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.40 kg (0.88 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Versamax carrier footprint\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive component\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eI\/O Type\u003c\/td\u003e\n\u003ctd\u003eSpring-style I\/O Carrier\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompatibility\u003c\/td\u003e\n\u003ctd\u003eVersamax Series\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe IC200CHS005 serves as the physical foundation for deterministic data transfer by providing a stable, low-resistance interface for I\/O modules connected to the backplane bus. Its design ensures that electrical signals originating from field devices are routed efficiently to the module electronics, maintaining the integrity required for high-speed communication networks. As a passive interconnect carrier, it supports the mechanical alignment necessary for the I\/O backplane to maintain consistent communication velocity across multiple connected segments, ensuring that signal propagation delays remain within the limits defined by the system's scan-cycle requirements.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does this carrier contain any internal electronic components or firmware?\u003c\/p\u003e\n\u003cp\u003eA: No, the IC200CHS005 is a passive interconnect carrier designed exclusively for terminal wiring and modular seating; it contains no active electronics, processing logic, or firmware.\u003c\/p\u003e\n\u003cp\u003eQ: How does the spring-style terminal mechanism improve field connection stability?\u003c\/p\u003e\n\u003cp\u003eA: The spring-style terminal provides constant pressure against the inserted wire, which enhances resistance to loosening caused by vibration, ensuring reliable electrical contact in industrial environments.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eDIN-Rail Mounting: Secure the carrier onto a 35 mm DIN rail. Ensure the sliding latch mechanism is fully locked to prevent the carrier from shifting during high-vibration operations.\u003c\/li\u003e\n\u003cli\u003eWiring Termination: Utilize appropriate wire stripping lengths to ensure full insertion into the spring-style terminals. Verify that the spring mechanism has secured the wire by performing a gentle pull test on each conductor.\u003c\/li\u003e\n\u003cli\u003eGrounding: Maintain continuity between the carrier grounding point and the system chassis ground bus. This is necessary to ensure that the shielding of connected field cables remains effective against electromagnetic interference.\u003c\/li\u003e\n\u003cli\u003eModule Seating: Before inserting the I\/O module, inspect the backplane pins for signs of bending or oxidation to ensure a clean, reliable electrical connection to the module circuitry.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52435892666680,"sku":"IC200CHS005","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/IC200CHS005.jpg?v=1780040073","url":"https:\/\/www.automodulexpert.com\/products\/ic200chs005-ge-fanuc-i-o-carrier-datasheet-technical-manual","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}