{"product_id":"ic200chs022n-ge-fanuc-i-o-carrier-datasheet-technical-manual","title":"IC200CHS022N GE Fanuc I\/O Carrier Datasheet \u0026 Technical Manual","description":"\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC200CHS022N\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC200CHS022N\u003c\/strong\u003e Box-Style I\/O Carrier, operates as a dedicated hardware component for signal interconnection and module housing within Versamax system networks. This carrier provides direct physical\/electrical execution, establishing the required backplane interface to facilitate high-density wiring and secure seating for modular I\/O components.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200CHS022N\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eVerify via product label\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.34 kg (0.75 lbs)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Versamax carrier footprint\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive component\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eI\/O Type\u003c\/td\u003e\n\u003ctd\u003eBox-Style I\/O Carrier\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompatibility\u003c\/td\u003e\n\u003ctd\u003eVersamax Series\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe IC200CHS022N carrier supports deterministic data transfer by providing a rigid, low-impedance mechanical interface for I\/O modules connected to the system backplane. Its design ensures that field signals are routed with high fidelity to the module backplane connectors, maintaining the signal integrity required for high-speed network communication. As a passive interconnect component, it is fundamental in maintaining consistent backplane bus communication velocity across multiple I\/O segments, ensuring that electrical signal propagation remains within the strict timing parameters of the system's scan-cycle requirements.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does this carrier contain any internal electronic circuitry or firmware?\u003c\/p\u003e\n\u003cp\u003eA: No, the IC200CHS022N is a passive box-style interconnect carrier designed for physical module seating and terminal wiring; it contains no active electronics or processing logic.\u003c\/p\u003e\n\u003cp\u003eQ: How does the box-style design differ from standard carriers?\u003c\/p\u003e\n\u003cp\u003eA: The box-style configuration provides an enclosed housing structure that offers improved mechanical protection for the backplane pins and terminal connections in industrial environments.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eDIN-Rail Mounting: Secure the carrier onto a 35 mm DIN rail. Ensure the integral latching mechanism is locked to prevent shifting or physical misalignment during high-vibration operation.\u003c\/li\u003e\n\u003cli\u003eWiring Termination: Utilize the box-style terminal layout to organize field wiring. Ensure wires are stripped to the required length and firmly seated to prevent loose connections that may induce signal noise.\u003c\/li\u003e\n\u003cli\u003eGrounding: Establish a low-impedance connection between the carrier chassis and the system earth ground. Proper grounding is essential to ensure that shielding on field cables remains effective against electromagnetic interference.\u003c\/li\u003e\n\u003cli\u003eModule Seating: Before installing an I\/O module, inspect the carrier's internal backplane pins for debris or oxidation. Ensure the module is inserted straight and clicks firmly into the locking tabs to guarantee electrical connectivity.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52436004110648,"sku":"IC200CHS022N","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/IC200CHS022N.jpg?v=1780040073","url":"https:\/\/www.automodulexpert.com\/products\/ic200chs022n-ge-fanuc-i-o-carrier-datasheet-technical-manual","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}