{"product_id":"ic200mdd844b-ge-fanuc-discrete-mixed-i-o-module-new-original-stock","title":"IC200MDD844B GE Fanuc Discrete Mixed I\/O Module New \u0026 Original Stock","description":"\u003cp\u003eConfigured for high-density discrete signal processing in Versamax control networks, the \u003cstrong\u003eGE Fanuc IC200MDD844B\u003c\/strong\u003e (\u003cstrong\u003eIC200MDD844B\u003c\/strong\u003e Discrete Mixed I\/O Module) provides direct physical\/electrical execution. This component handles integrated switching operations within the Versamax system architecture, maintaining logic state consistency through the I\/O backplane.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200MDD844B\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eVerify via product label\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.38 lbs (0.17 kg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Versamax module footprint\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eBackplane dependent\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eI\/O Type\u003c\/td\u003e\n\u003ctd\u003eDiscrete Mixed\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompatibility\u003c\/td\u003e\n\u003ctd\u003eVersamax Series\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe IC200MDD844B module supports deterministic data exchange within the Versamax backplane, ensuring synchronized state transmission across the controller bus. When integrated into distributed I\/O systems, the module utilizes internal timing protocols to maintain scan-cycle alignment. The module architecture facilitates high-speed data bus communication, minimizing jitter during signal transitions between the I\/O circuitry and the central processor. Firmware compatibility must be verified with the master CPU to ensure the correct handling of mixed signal packets during the update process.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the IC200MDD844B support hot-swap capabilities in an energized backplane?\u003c\/p\u003e\n\u003cp\u003eA: The Versamax platform generally supports module removal and insertion under power; however, verify the specific rack configuration and CPU firmware support before executing hot-swaps to prevent potential I\/O state disruptions.\u003c\/p\u003e\n\u003cp\u003eQ: What is the recommended procedure for wiring discrete inputs to this module?\u003c\/p\u003e\n\u003cp\u003eA: Ensure that common returns are properly tied to the specified potential. Use shielded twisted-pair cabling to reduce electromagnetic interference, ensuring that the shield is terminated at the designated earth ground point to maintain signal integrity.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eMounting: Align the module onto the DIN-rail backplane and ensure the locking tabs click firmly into place to provide mechanical stability.\u003c\/li\u003e\n\u003cli\u003eShielding: All discrete input and output signal lines must be separated from high-voltage AC lines to prevent crosstalk and induced noise.\u003c\/li\u003e\n\u003cli\u003eGrounding: Connect the module chassis ground terminal to the main system grounding bus using a low-impedance conductor.\u003c\/li\u003e\n\u003cli\u003eTermination: Ensure wiring engagement is secure; verify that stripped wire ends do not exceed the terminal block capacity to avoid potential shorts.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52435676102968,"sku":"IC200MDD844B","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/IC200MDD844B.jpg?v=1780040073","url":"https:\/\/www.automodulexpert.com\/products\/ic200mdd844b-ge-fanuc-discrete-mixed-i-o-module-new-original-stock","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}