IC200MDL750A General Electric Discrete Output Module | Datasheet

IC200MDL750A General Electric Discrete Output Module | Datasheet
IC200MDL750A General Electric Discrete Output Module | Datasheet
IC200MDL750A General Electric Discrete Output Module | Datasheet
IC200MDL750A General Electric Discrete Output Module | Datasheet
IC200MDL750A General Electric Discrete Output Module | Datasheet
IC200MDL750A General Electric Discrete Output Module | Datasheet

IC200MDL750A General Electric Discrete Output Module | Datasheet

This IC200MDL750A Discrete Output Module was manufactured by GE FANUC, In Stock, 100% Guaranteed Brand New and Authentic. Link to More Information

 
Manufacturer:
GE FANUC
Part Number:
IC200MDL750A
Product type:
Country of Origin:
USA
Condition:
New With Original Package
Shipping Port:
ShangHai, Xiamen
Warranty:
12 Months
Collections:
 

Configured for high-density DC signal switching in VersaMax control networks, the GE Fanuc IC200MDL750A (IC200MDL750A Discrete Output Module) provides direct physical/electrical execution. This hardware component interfaces controller logic with field devices by providing 32 points of positive logic DC output switching.

Suffix Breakdown & Model Matrix

The IC200MDL750A is a fixed-configuration discrete output module designed for high-density I/O arrays. The "A" suffix denotes the initial hardware design iteration, providing standard 12/24 VDC output switching capability within the VersaMax I/O platform.

Hardware Specifications

Parameter Specification
Model IC200MDL750A
Brand General Electric
Origin USA
Weight 0.14 kg
Dimensions 11 cm x 5.8 cm x 6.7 cm
Operating Temp 0 to 60 deg C
Power Consumption 5 VDC backplane current consumption
Output Density 32 discrete points
Output Rating 12/24 VDC at 0.5 A per point

Profinet / EtherNet/IP Deterministic Networks

The IC200MDL750A module utilizes the VersaMax backplane bus to ensure synchronization between the host controller and field output states. Integration requires correct mapping of the 32-bit output register within the controller configuration. The module supports deterministic network environments by maintaining high-speed throughput, which minimizes output jitter. Users must verify firmware flash compatibility with the backplane communication module to ensure stable data transmission during high-density I/O scanning cycles.

Frequently Asked Questions

Q: Does this module support hot-swap capabilities during operation?

A: The module is hot-swappable; however, users must disconnect field power from the terminal base prior to removal to prevent terminal arcing and protect the internal output transistors.

Q: How is the output logic defined for this module?

A: The IC200MDL750A is configured for positive logic (sourcing) output, meaning the module provides the positive side of the supply voltage to the field load when the output is energized.

Field Installation Guidelines

  • Verify that the terminal base is locked onto the 35 mm DIN rail or panel surface before inserting the module to ensure proper backplane connector alignment.
  • Ensure that the total current draw per common does not exceed the internal trace rating; distribute field loads across common points to prevent overheating.
  • Route field wiring through dedicated conduits, keeping output lines separated from high-voltage AC cabling to prevent inductive noise injection.
  • Verify the polarity of the 12/24 VDC field power supply before connecting it to the module's power input terminals to avoid permanent damage to the output stages.
  • Tighten all terminal connections to ensure low contact resistance, which is essential for maintaining the 0.5 A current capacity per point.
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