{"product_id":"ic200mdl750d-ge-fanuc-discrete-output-module-new-original-stock","title":"IC200MDL750D GE Fanuc Discrete Output Module New \u0026 Original Stock","description":"\u003cp\u003eConfigured for high-density discrete switching in industrial control networks, the \u003cstrong\u003eGE Fanuc IC200MDL750D\u003c\/strong\u003e (\u003cstrong\u003eIC200MDL750\u003c\/strong\u003e Discrete Output Module) provides direct physical execution of output signals for process control actuation.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eIC200\u003c\/strong\u003e: Versamax series product identifier.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMDL\u003c\/strong\u003e: Module classification.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e750\u003c\/strong\u003e: 32-point discrete output module configuration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eD\u003c\/strong\u003e: Hardware revision level indicating design iteration for high-density backplane synchronization.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC200MDL750D\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc Emerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eSubject to manufacturing batch\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.31 lbs (0.14 kg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Versamax I\/O form factor\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eDefined by backplane load\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Channels\u003c\/td\u003e\n\u003ctd\u003e32-point discrete\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks\u003c\/h3\u003e\n\u003cp\u003eThe IC200MDL750D integrates into Versamax nodes that support deterministic communication protocols. The module utilizes the backplane bus to ensure consistent update rates for 32 discrete output points. When configured within a Profinet or EtherNet\/IP architecture, the module latency is governed by the assigned Requested Packet Interval (RPI) and the backplane bus communication velocity. Users must verify firmware flash compatibility against the CPU base firmware to ensure the discrete mapping matches the configured hardware registry, specifically to handle the increased I\/O density scaling required for high-point-count control applications.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the IC200MDL750D support hot-swapping while the backplane is energized?\u003c\/p\u003e\n\u003cp\u003eA: Yes, the Versamax design allows for the removal and insertion of the module while the system is powered, provided the specific hazardous location and installation codes are observed.\u003c\/p\u003e\n\u003cp\u003eQ: Are there any specific loading limitations for this 32-point module?\u003c\/p\u003e\n\u003cp\u003eA: Yes, refer to the technical manual for aggregate current limits per common and per module to ensure that simultaneous activation of all 32 outputs does not exceed the thermal or electrical capacity of the module circuitry.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eEnsure the DIN-rail mounting is secure and grounded to the common earth point to minimize electrical noise impact on output switching.\u003c\/li\u003e\n\u003cli\u003eVerify that the backplane connector pins are free of debris before insertion to prevent contact resistance or pin damage during installation.\u003c\/li\u003e\n\u003cli\u003eRoute output wiring in cable trays separate from high-voltage AC lines to prevent inductive coupling and unintended cross-talk.\u003c\/li\u003e\n\u003cli\u003eApply correct torque to terminal connectors to ensure long-term mechanical stability and reliable electrical path for the discrete switching circuits.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE FANUC","offers":[{"title":"Default Title","offer_id":52450998452536,"sku":"IC200MDL750D","price":220.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0893\/1616\/3896\/files\/IC200MDL750C.jpg?v=1779699804","url":"https:\/\/www.automodulexpert.com\/products\/ic200mdl750d-ge-fanuc-discrete-output-module-new-original-stock","provider":"AutoModuleXpert Ltd.","version":"1.0","type":"link"}