IS210MACCH2A General Electric I/O Board | New & Original Stock

IS210MACCH2A General Electric I/O Board | New & Original Stock
IS210MACCH2A General Electric I/O Board | New & Original Stock
IS210MACCH2A General Electric I/O Board | New & Original Stock
IS210MACCH2A General Electric I/O Board | New & Original Stock
IS210MACCH2A General Electric I/O Board | New & Original Stock
IS210MACCH2A General Electric I/O Board | New & Original Stock

IS210MACCH2A General Electric I/O Board | New & Original Stock

This IS210MACCH2A I/O Board was manufactured by GE FANUC, In Stock, 100% Guaranteed Brand New and Authentic. Link to More Information

 
Manufacturer:
GE FANUC
Part Number:
IS210MACCH2A
Product type:
Country of Origin:
USA
Condition:
New With Original Package
Shipping Port:
ShangHai, Xiamen
Warranty:
12 Months
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The General Electric IS210MACCH2A, also cataloged as the IS210MACCH2 I/O Board, operates as a dedicated hardware component for signal acquisition and I/O management within Mark VI control network platforms.

Suffix Breakdown & Model Matrix

  • IS210: Printed circuit board assembly (Mark VI series).
  • MACC: Functional identifier for the I/O Controller and signal interface architecture.
  • H2: Hardware version index indicating secondary configuration tier.
  • A: Design revision level for board-level component integration.

Hardware Specifications

Parameter Specification
Model IS210MACCH2A
Brand General Electric
Origin United States
Weight 0.24 kg
Dimensions 14.8 cm x 10.3 cm x 3.2 cm
Operating Temp -20 deg C to +60 deg C
Power Consumption 5 VDC / 24 VDC backplane derived
Mounting Chassis card slot insertion

Backplane Bus Communication Velocity and Firmware Compatibility

The IS210MACCH2A functions as a bridge for high-speed data transmission between field sensors and the central control processor. It utilizes the standard Mark VI backplane bus to maintain deterministic communication velocity. To ensure successful integration, users must confirm firmware flash compatibility with the existing rack controller software. Updating the firmware to the latest revision is recommended to support advanced diagnostic reporting and to ensure optimal latency synchronization across the I/O network.

Frequently Asked Questions

Q: Is this board susceptible to data loss if backplane power is interrupted?

A: No. The board utilizes non-volatile memory for configuration storage. However, active signal states will reset to a default defined state upon power restoration.

Q: Does this board support hot-swapping within the Mark VI rack?

A: No. This board is not rated for hot-swapping. Always isolate power to the specific I/O rack segment before attempting to remove or install the module to prevent electrical stress on the backplane connectors.

Field Installation Guidelines

  1. Static Precautions: Use an ESD-safe workstation and grounded wrist strap when handling the board to prevent latent damage to the integrated circuits.
  2. Rack Preparation: Ensure the target rack slot is free of dust and that the backplane pins are straight.
  3. Insertion: Slide the board into the designated guides, ensuring the edge connector aligns perfectly with the backplane socket. Apply firm, even pressure to seat the module fully.
  4. Securing: Tighten the front panel mounting screws to ensure the board is grounded to the rack chassis, which is necessary for common-mode noise suppression.
  5. System Validation: Power up the rack and monitor the control interface for successful module initialization. A solid status light indicates successful communication with the host processor.
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Shipping Port ShangHai, Xiamen
Warranty 12 Months
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