The GE DS200TCCBG1B, also cataloged as the DS200TCCBG1B Temperature Control Card, operates as a dedicated hardware component for RTD signal acquisition and processing within Mark V control system platforms.
Suffix Breakdown & Model Matrix
- DS200: Denotes the Mark V hardware series.
- TCCB: Specifies the Temperature Control Card board identification.
- G1: Indicates the hardware group level.
- B: Reflects the specific revision status of the board assembly.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | DS200TCCBG1B |
| Brand | General Electric |
| Origin | USA |
| Weight | 0.35 kg |
| Dimensions | 20.3 x 8.5 x 2.5 cm |
| Operating Temp | -40 to +70 deg C |
| Power Consumption | 1.5 W |
| Sensor Type | RTD |
Profinet / EtherNet/IP deterministic networks
The DS200TCCBG1B executes high-resolution analog-to-digital conversion to translate resistive temperature detector inputs into localized digital process values. The card architecture facilitates deterministic data packet transmission over the I/O bus, ensuring that thermal monitoring latency remains within strict control loop requirements. It manages the excitation current for the RTD bridges and performs local signal conditioning before passing data to the main processor for scaling and limit comparison.
Frequently Asked Questions
Q: Is this board compatible with different types of RTD sensors, such as PT100 and PT1000?
A: The card is calibrated for specific RTD resistance curves. Review the system configuration manual for the target Mark V panel to ensure the excitation and scaling parameters match your specific sensor type.
Q: What is the recommended practice for shielding RTD signal wiring?
A: All sensor leads must be terminated using twisted-shielded pair cabling. The shield should be grounded only at the panel entry point to prevent ground loop currents that could introduce noise into the low-voltage analog signal path.
Field Installation Guidelines
- Confirm all power is removed from the I/O rack prior to installation to avoid damage to the backplane communication pins.
- Insert the card into the designated slot, verifying proper engagement with the backplane connector.
- Tighten the retaining screws on the module faceplate to ensure chassis ground continuity.
- Connect RTD leads to the terminal board, ensuring proper polarity and connection integrity for 3-wire or 4-wire configurations.
- Verify signal validity by checking the status LEDs and the diagnostic screen on the Mark V operator interface after system initialization.
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