Overview

The Trusted® TMR Expander Processor Module resides in the processor slots of the Trusted Expander Chassis and provides the 'slave' interface between the Expander Bus and the Expander Chassis Backplane. The Expander Bus enables multiple chassis systems to be connected using Unshielded Twisted Pair (UTP) cable connections while maintaining the fault-tolerant, high-bandwidth Inter-Module Bus (IMB) capabilities.

Specifications

Power Requirements:

• Backplane (IMB) Supply: 20 Vdc to 32 Vdc
• Field Supply: N/A
• Power Dissipation: 45 W Backplane Supply

Module Location:

• T8300 Expander Processor Slot

Isolation:

• 50 V Basic Insulation, Module to Backplane Supply

Fusing:

• Not User Serviceable

Expander Communications Max Distance:

• Using TC-301 copper cable: 30 m
• Using T8314 Fibre TX/RX Units: 10 km

Environmental Conditions:

• Operating Temperature: 0 °C to +60 °C (+32 °F to +140 °F)
• Storage Temperature: -25 °C to +70 °C (-13 °F to +158 °F)
• Relative Humidity (Operating and Storage): 10% – 95%, non-condensing
• Environmental Specifications: Refer to document 552517

Dimensions:

• Height: 266 mm (10.5 in)
• Width: 31 mm (1.2 in)
• Depth: 303 mm (12.0 in)
• Weight: 1.33 kg (2.9 lb)