The GE Fanuc IS200TRTDH1CI, also cataloged as the IS200TRTDH1 RTD Input Terminal Board, operates as a dedicated hardware component for signal acquisition and conditioning of temperature inputs within the Mark VIe turbine control system.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IS200TRTDH1CI |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 0.45 kg |
| Dimensions | 178 mm x 330 mm |
| Operating Temp | 0 deg C to 60 deg C |
| Power Consumption | Determined by I/O core load |
| Input Channels | 16 (3-wire RTD configuration) |
| RTD Types | PT100 (standard), software configurable |
| Interface Connectors | Dual 37-pin female D-sub |
Backplane Bus and Communication Integrity
The IS200TRTDH1CI utilizes a high-density passive interface architecture designed for integration within the Mark VIe I/O core chassis. Communication between the terminal board and the processor module is facilitated through dual 37-pin D-sub connectors, ensuring high-speed signal routing from the field inputs to the I/O processing layer. The board incorporates localized signal conditioning via an integrated capacitor array, which provides essential noise suppression for sensitive RTD circuits. Firmware compatibility is maintained through standard backplane bus protocols, allowing the Mark VIe system to perform deterministic polling of temperature data across R, S, or T cores without introducing latency into the control loop.
Frequently Asked Questions
Q: Can the IS200TRTDH1CI be hot-swapped during active system operation?
A: No, physical removal or replacement of the terminal board while the I/O core is energized is not recommended due to potential floating inputs and disruption of the 3-wire RTD current return paths.
Q: How should the field wiring be terminated to ensure signal stability?
A: Field wiring must be secured to the 24-position barrier-type terminal blocks. Ensure that the cable shield is grounded at the designated chassis landing point to minimize electromagnetic interference (EMI) on the RTD signal loops.
Field Installation Guidelines
- Ensure the I/O core chassis is powered down and the protective ground is verified before handling the board.
- Align the board within the specified I/O core chassis slot (R, S, or T) and engage the mounting hardware to secure the board against the chassis backplane.
- Connect the dual 37-pin D-sub cables to the corresponding female headers on the board, ensuring the locking screws are tightened to prevent connection vibration.
- Terminate the 3-wire RTD field cables to the barrier terminal blocks. Maintain consistent polarity across all 16 channels to prevent measurement offsets.
- Verify signal continuity with a digital multimeter before initiating system power-up, ensuring no short circuits exist between the RTD high/low leads and the chassis ground.
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| Shipping Port | ShangHai, Xiamen |
| Warranty | 12 Months |
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