Configured for power regulation and distribution in Mark VIe control systems, the General Electric IS200JPDHG1A (IS200JPDHG1A I/O Pack Power Distribution Card) provides direct physical and electrical execution of auxiliary power management tasks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IS200JPDHG1A |
| Brand | General Electric |
| Origin | USA |
| Weight | 0.45 kg |
| Dimensions | 21.59 cm x 18.42 cm |
| Operating Temp | -40 deg C to 70 deg C |
| Power Consumption | 24 VDC nominal |
| Max Current Output | 10 A |
Profinet / EtherNet/IP Deterministic Networks
The IS200JPDHG1A serves as a distribution node for I/O pack power, ensuring stable voltage delivery across the deterministic control network. It facilitates the conversion and management of 24 VDC power streams to support I/O modules requiring high-availability supply. The board is optimized for integration with the Mark VIe backplane communication structure, maintaining voltage regulation during peak I/O demand. Precise electrical termination is required to support the high current capacity of 10 A while minimizing thermal dissipation and voltage ripple within the control cabinet.
Frequently Asked Questions
Q: Does the board support hot-swapping under full load?
A: Hot-swapping is restricted. The power distribution board must be isolated from the main supply to prevent contact arcing or potential damage to the backplane power pins during extraction or insertion.
Q: How is the 10 A output capacity managed across multiple channels?
A: The total output current is distributed through the board's internal power planes; ensure that individual load segments do not exceed the circuit protection limits of the specific terminal configuration connected to the card.
Field Installation Guidelines
- Verify that the power distribution board is installed in a clean, dry environment within the specified operating temperature range of -40 deg C to 70 deg C.
- Ensure that all 24 VDC input wiring is properly rated for the 10 A current throughput to prevent resistive heating and voltage drop.
- Confirm that the chassis mounting points are used to establish a solid ground connection, which is required for effective surge suppression and EMI mitigation.
- Inspect the backplane interface pins for any signs of mechanical stress or contamination before locking the module into its final operating position.
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| Warranty | 12 Months |
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