Configured for high-density I/O routing in Field Control systems, the GE Fanuc IC670CHS002 (IC670CHS002 I/O Terminal Base) provides direct physical/electrical execution for module mounting and backplane signal propagation.

Suffix Breakdown & Model Matrix

The IC670CHS002 is the base-level terminal block for two-module configurations. Users requiring specific hot-swap capabilities under dynamic system conditions should refer to the IC670CHS102 variant, which includes the necessary latching mechanisms and backplane compatibility logic.

Hardware Specifications

Profinet and EtherNet/IP Deterministic Networks

The IC670CHS002 serves as a passive structural component that ensures backplane bus communication velocity remains stable. By providing a low-impedance path between the I/O modules and the Bus Interface Unit (BIU), this terminal base minimizes electrical noise and signal reflection. Proper installation is required to maintain the deterministic network timing specified for Field Control platforms, as oxidized or loose terminal contacts can introduce micro-interruptions that affect communication integrity.

Frequently Asked Questions (FAQ)

Q: Are the common terminal groups electrically linked to the backplane communication bus?

A: No. The A, B, and E common terminal groups are galvanically isolated from the internal backplane communication signals, serving exclusively as distribution points for power or common return paths.

Q: Is this base compatible with all Field Control I/O modules?

A: The IC670CHS002 is designed for standard Field Control modules. Users must ensure that the physical keying of the module matches the base to prevent electrical damage during insertion.

Field Installation Guidelines

1. Secure the terminal base to a standard DIN rail using the integrated spring-loaded latches; ensure the rail is adequately grounded to the enclosure backplane.
2. Observe a torque specification of 4.5 in/lbs when fastening wires into the box terminals to ensure optimal contact pressure without damaging the terminal threads.
3. Utilize 90 deg C rated copper conductors to comply with the thermal dissipation requirements of the terminal block under full 10 A load.
4. When wiring the E-group terminals, ensure they are kept separate from the A and B power groups to maintain the integrity of the isolated common return.
5. If module removal is required, unlock the module from the base to disconnect the backplane pins; the base allows this without requiring the disconnection of field-side wiring.