IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock

IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock
IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock
IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock
IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock
IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock
IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock

IS200TREGH1BDC GE Trip Emergency Board | New & Original Stock

This IS200TREGH1BDC Trip Emergency Board was manufactured by GE FANUC, In Stock, 100% Guaranteed Brand New and Authentic. Link to More Information

 
Manufacturer:
GE FANUC
Part Number:
IS200TREGH1BDC
Product type:
Country of Origin:
USA
Condition:
New With Original Package
Shipping Port:
ShangHai, Xiamen
Warranty:
12 Months
Collections:
 

The GE IS200TREGH1BDC, also cataloged as the IS200TREGH1B Trip Emergency Termination Board, operates as a dedicated hardware component for emergency shutdown signal distribution and turbine trip logic within Mark VI control networks.

Hardware Specifications

Parameter Specification
Model IS200TREGH1BDC
Brand General Electric
Origin USA
Weight 0.5 kg
Dimensions 0.54 cm x 1.19 cm x 0.96 cm
Operating Temp 0 to 60 deg C
Power Consumption 5 W (nominal)
Function Trip Emergency Interface

Backplane Bus Communication and Firmware Compatibility

The IS200TREGH1BDC facilitates the interface between primary control processors and field-side trip actuators. This terminal board maintains specific backplane bus communication velocity to ensure that trip commands are transmitted across the I/O backplane without latency penalties. Firmware flash compatibility is intrinsically linked to the control I/O pack firmware; ensure the host controller remains within the verified version matrix to support the "DC" board revision. Data integrity is maintained via parity checking on the backplane interface to prevent spurious trip activation due to transient electrical noise.

Frequently Asked Questions

Q: Does this board support hot-swap configuration?

A: Yes, the IS200TREGH1BDC is designed for hot-swap replacement within the Mark VI rack. However, the associated trip signal chains must be bypassed or verified at the HMI to prevent an unintended system trip during the extraction or insertion process.

Q: How should redundant trip signals be connected to this terminal board?

A: Redundant trip signals must be wired to separate terminal blocks or I/O channels as specified in the system-specific wiring diagram. Proper galvanic isolation must be maintained between independent trip paths to ensure that a single component failure on the board does not propagate to the redundant channel.

Field Installation Guidelines

  • Verify that all cabinet power supplies are de-energized before mounting the board to the DIN rail or backplane assembly to prevent accidental short-circuits.
  • Ensure the board is properly grounded to the cabinet chassis using the provided mounting points to ensure electromagnetic compatibility and protection against surge events.
  • When terminating field wiring, strip the insulation to the minimum required length and verify that no stray wire strands extend beyond the terminal screw connection.
  • Inspect the connector pins on the rear of the board for signs of oxidation or deformation prior to seating the board into the backplane.
  • After installation, perform a continuity check on the field-side trip loop to confirm that the circuit resistance is within the expected range for the actuator coil or relay being driven.
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Shipping Port ShangHai, Xiamen
Warranty 12 Months
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